| 摘要 |
An effective and easy to fabricate method to test multiple integrated circuit device designs using a single, probe card design is provided. A universal, probe card design is disclosed herein to test a plurality of integrated circuit devices at the wafer level. Integrated circuit probe pads and probe card probe I/O pins are designed in grid-like pattern on a region of the substrate. Ground terminal encircles the region of the I/O pins and power terminals are provided on the substrate. The I/O terminals can have a constant pitch array or a varying pitch array. The probe card can be used for a family of integrated circuit devices. A method to test flip chip, integrated circuits using a universal probe card has also been disclosed to reduce probe card proliferation and fabrication cost.
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