发明名称 Polishing method and polishing system
摘要 A polishing method includes supplying a slurry onto a pad disposed above a turntable while rotating the turntable, and polishing a workpiece disposed on the pad by pressing the workpiece to the pad, and detecting an ion concentration of a specific ion included in the slurry on the pad by using an ion test paper during the polishing.
申请公布号 US2006068684(A1) 申请公布日期 2006.03.30
申请号 US20050231755 申请日期 2005.09.22
申请人 KUBOTA TAKEO 发明人 KUBOTA TAKEO
分类号 B24B1/00;B24B37/00;B24B49/12;B24B57/02 主分类号 B24B1/00
代理机构 代理人
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