| 发明名称 |
METHOD FOR ASSEMBLING AN OPTO-ELECTRIC MODULE AND A STRUCTURE OF AN OPTO-ELECTRIC MODULE |
| 摘要 |
The invention relates to an optoelectronic module (200) and a method for manufacturing an optoelectronic module (200). In the method, at least one optoelectronic component (27) and several other components (28, 60) are placed on a base (20) and connections are formed between the optoelectronic component (27) and the other components (28, 60) with the aid of contacts (64, 26a, 26b) of said base (20). According to the invention, the optoelectronic component (27) and the other components (28, 60) are located on the side of the base (20) on which contact bumps (21a, 21b) are located. |
| 申请公布号 |
WO2006032726(A1) |
申请公布日期 |
2006.03.30 |
| 申请号 |
WO2005FI00402 |
申请日期 |
2005.09.22 |
| 申请人 |
ASPOCOMP TECHNOLOGY OY;MUUKKONEN, ESA;VON LERBER, TUOMO;HIETALA, JONI;KAUMA, KARI;PAASO, JASKA |
发明人 |
MUUKKONEN, ESA;VON LERBER, TUOMO;HIETALA, JONI;KAUMA, KARI;PAASO, JASKA |
| 分类号 |
H01L23/488;G02B;G02B6/42;H01L23/31;H01L23/367;H01L23/48;H01L25/16;H01L31/0203;H01L31/0232;H01L31/18;H01R12/57;H01S5/00;H01S5/02;H01S5/022;H05K1/18 |
主分类号 |
H01L23/488 |
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