发明名称 |
Method and device for packaging a substrate |
摘要 |
A package structure and method of packaging for an interferometric modulator. A thin film material is deposited over an interferometric modulator and transparent substrate to encapsulate the interferometric modulator. A gap or cavity between the interferometric modulator and the thin film provides a space in which mechanical parts of the interferometric modulator may move. The gap is created by removal of a sacrificial layer that is deposited over the interferometric modulator. |
申请公布号 |
US2006067641(A1) |
申请公布日期 |
2006.03.30 |
申请号 |
US20050045738 |
申请日期 |
2005.01.28 |
申请人 |
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发明人 |
PALMATEER LAUREN;CUMMINGS WILLIAM J.;GALLY BRIAN;MILES MARK;SAMPSELL JEFFREY B.;CHUI CLARENCE;KOTHARI MANISH |
分类号 |
G02B6/00 |
主分类号 |
G02B6/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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