| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a bus bar structure for a semiconductor module, the wiring inductance of which is reduced and wherein high-temperature molding resin will not flow between positive/negative power supply connection terminals of each of switching elements at insert molding, and wherein the insulation member between the connection terminals will not deteriorate. <P>SOLUTION: In the bus bar structure for connecting each switching element of the semiconductor module to a power supply, positive/negative power supply connection terminals of each switching element are formed integrally and contained in a resin case, and located to provide facing regions, wherein at least parts of mutual principal faces of the connection terminal face nearly in parallel, an insulating material is located between the facing regions, and insert molding is carried out so that no resin is in contact with the insulating member. The size of the insulating member in the length direction is selected to be smaller than the size of the positive/negative power supply connection terminals, and the insulating material is located in the inside, and a folded part or a step difference part is formed to both ends, in the width direction of one or both the positive/negative power supply connection terminals. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
