| 摘要 |
PROBLEM TO BE SOLVED: To reduce the contamination of a material in a placement table occurring from the substrate placement table by reducing damage that the substrate placement stand receives. SOLUTION: A cylindrical peripheral cover 17 is provided at a susceptor (substrate placement stand) 11 for placing a wafer 200 on an upper surface 10. In the peripheral cover 17, the upper end 17a is folded back to the inside, the upper surface of the periphery of the susceptor 11 projecting from the wafer 200 is covered, and the side 14 is covered at the middle section. And a lower end 17b in the peripheral cover 17 is extended downward from the lower surface 15 of the susceptor 11, thus covering the lower surface 15 indirectly. COPYRIGHT: (C)2006,JPO&NCIPI |
