| 摘要 |
PROBLEM TO BE SOLVED: To form wirings while protecting the surface of a wiring-metal film from a damage such as oxidation and pollution so as to make easier the flattening process of the surface thereafter. SOLUTION: There is prepared a substrate W obtained by forming recesses 42 for wirings in an insulating film and covering the surface of the recesses 42 with a barrier film 44. A wiring-metal film 48 is formed on the surface of the substrate W and a wiring metal is buried in the recesses 42 for wiring. A polymer protective film 50 is formed on the surface of the wiring-metal film 48. COPYRIGHT: (C)2006,JPO&NCIPI
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