| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component and a semiconductor device that are capable of reducing cost or improving reliability in connecting chips together or chips to a circuit board as well as a method of fabricating the same, and further a circuit board having the same mounted thereon and an electronic apparatus having the circuit board. SOLUTION: The semiconductor device is an integrated semiconductor device capable of reducing cost or improving reliability in connecting chips together or chips to a circuit board. The integrated semiconductor device includes a first semiconductor device 10 having a semiconductor chip 12 with electrodes 16, a stress-relieving layer 14 provided on the semiconductor chip 12, wiring 18 formed on the stress-relieving layer 14 from the electrodes 16, and solder balls 19 formed on the wiring 18 over the stress-relieving layer 14; and a bare chip 20 as a second semiconductor device to be electrically connected to the first semiconductor device 10. COPYRIGHT: (C)2006,JPO&NCIPI |
