| 摘要 |
PROBLEM TO BE SOLVED: To independently and electrically connect a circuit formed in each semiconductor chip to a printed wiring board in a semiconductor device, constituted by mounting two semiconductor chips on the printed wiring board, in a laminated state where the electrodes of the chips are brought into contact with each other. SOLUTION: One electrode 7 between two electrodes 7 and 13, which are brought into contact with each other, is formed in a state where the electrode 7 is electrically connected to the chip circuit 6 of a first semiconductor chip 5 to which the electrode 7 belongs, and the other electrode 13 is formed as a dummy electrode which is not electrically connected to the chip circuit 12 of a second semiconductor chip 11 to which the electrode 13 belongs. In addition, one electrode 14 between two electrodes 14 and 8, which are brought into contact with each other, is formed in a state where the electrode 14 is electrically connected to the chip circuit 12 of the second semiconductor chip 11 to which the electrode 14 belongs, and the other electrode 8 is formed as a dummy electrode which is not electrically connected to the chip circuit 6 of the first semiconductor chip 5 to which the electrode 8 belongs. Moreover, the chip circuits 6 and 12 of the first and second semiconductor chips 5 and 11 are connected independently and electrically to the printed wiring board 1. COPYRIGHT: (C)2006,JPO&NCIPI
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