| 摘要 |
PROBLEM TO BE SOLVED: To provide bump forming method and device thereof having no possibility of breakage of an electronic component upon forming a bump, even in the electronic component having an interlayer insulating film of low strength. SOLUTION: The bump forming method comprises a process for forming or retaining a bump forming member at the tip end of a bonding tool, a process for shaping the bump forming member while pushing the same against a shaping stage by the bonding tool, a process for positioning the shaped bump forming member on the electrode of the electronic component to abut the same against the electrode, a process for forming a bump on the electrode by giving bonding energy from the bonding tool to a space between the bump forming member and the electrode to bond the same, and a process for separating the bonding tool from the bump. In this case, the bump forming member is pushed against the shaping stage to shape the same previously whereby a load applied upon bonding the bump forming member to the electrode of the electronic component is remarkably reduced, and the bump can be formed without possibility of breakage of the electronic component even in the electronic component having the interlayer insulating film of low strength. COPYRIGHT: (C)2006,JPO&NCIPI
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