| 摘要 |
PROBLEM TO BE SOLVED: To provide a polyimide film which exhibits a high modulus and is excellent in runnability flexibility, low moisture expansion coefficient, thermal dimensional stability and film formability, when employed for a substrate for metal wiring boards for flexible printed circuits on the surface of which metal wiring is provided, CSP's, COF's, BGA's or tape automated bonding tapes (TAB tapes), its manufacturing process and a metal wiring board using it as a substrate. SOLUTION: The polyimide film is produced from a polyamic acid consisting of 10-90 mol% naphthalenetetracarboxylic acid dianhydride and 90-10 mol% biphenyltetracarboxylic acid dianhydride based on the acid dianhydride and 5-50 mol% paraphenylenediamine and 50-95 mol% 1,3-bis(4-aminophenoxy)benzene based on the diamine, contains 0.01-1 wt.% barium sulfate or calcium hydrogenphosphate having a primary particle size of less than 1μm and has a friction coefficient of less than 0.5. COPYRIGHT: (C)2006,JPO&NCIPI
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