发明名称 |
Method of manufactruing circuit board |
摘要 |
A pre-preg sheet including a substrate and a resin impregnated in the substrate is provided. A first metal foil is placed on the pre-preg sheet to provide a laminated body. The laminated body is put in a heating device having a temperature maintained at a temperature close to a softening temperature of the resin. The laminated body is compressed at the temperature at a predetermined pressure. The first metal foil is bonded to the pre-preg sheet of the laminated body and hardening the resin, thus providing a circuit board. This method provides a stable resistance of a conductive paste filling a through-hole in the pre-preg sheet to be compressed at a small rate.
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申请公布号 |
US2006064871(A1) |
申请公布日期 |
2006.03.30 |
申请号 |
US20050535158 |
申请日期 |
2005.05.16 |
申请人 |
KAWAKITA YOSHIHIRO;TAKENAKA TOSHIAKI;TOJYO TADASHI |
发明人 |
KAWAKITA YOSHIHIRO;TAKENAKA TOSHIAKI;TOJYO TADASHI |
分类号 |
B32B15/08;H01R43/00;B32B15/14;H05K3/02;H05K3/12;H05K3/40;H05K3/46 |
主分类号 |
B32B15/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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