发明名称 Method for molding a molded product and housing for electronic apparatus
摘要 A method for molding a molded product including a case having a basic thickness and a rib section integrally projecting from the case and a projection height of which is large relative to the basic thickness, including: forming an injection-molding cavity being in communication with a case-molding cavity and a rib-section-molding cavity by closing a first mold and a second mold; locating a projecting strip, which is formed on an inner surface of the first mold and having an inclined face for guiding a flow of a molten resin material in a direction of the rib-section-molding cavity, at a position opposing the rib-section-molding cavity; injecting the molten resin or the molten metal material into the injection-molding cavity, to thus fill the injection-molding cavity therewith; and opening the first mold and the second mold, thereby retrieving a molded product from the injection-molding cavity.
申请公布号 US2006068136(A1) 申请公布日期 2006.03.30
申请号 US20050208290 申请日期 2005.08.19
申请人 KINJOU KAZUYUKI;HIRAO HIROAKI;TAKADA MASAAKI 发明人 KINJOU KAZUYUKI;HIRAO HIROAKI;TAKADA MASAAKI
分类号 B29C45/00;B31B45/00 主分类号 B29C45/00
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