| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition capable of diminishing film defects and capable also of reducing the number of film defects. <P>SOLUTION: The photosensitive resin composition contains (A) a photosensitive resin, (B) a photopolymerization initiator and (C) a filler, wherein a maximum particle size of the filler (C) is ≤30 μm, and on a particle size distribution curve of the filler (C), an integral area of the particle size range of 20-100 μm is <2.0% of that of the particle size range of 0.1-100 μm. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
