| 摘要 |
PROBLEM TO BE SOLVED: To prevent degradation in quality of a semiconductor device by removing cutting chips generated at dicing. SOLUTION: Suction is carried out from the surface side of a semiconductor substrate 1 opposite to the rear surface applied with a tape 2 following to dicing. Consequently, adhesive 2a of the tape 2 can enter into a space 3 formed by a trench 1a. Consequently, cutting chips 5 remaining in the space 3 formed by the trench 1a can adhere to the adhesive 2a and the cutting chips 5 adhering to each chip can be removed, when each chip is stripped from the tape 2. When the semiconductor substrate 1 is diced into chip units, the quality of semiconductor device can be prevented from degrading. COPYRIGHT: (C)2006,JPO&NCIPI |
