| 摘要 |
PROBLEM TO BE SOLVED: To provide a film deposition method where electrical wiring of low resistance can be deposited with high production capacity as the amount of a noble metal material to be used is reduced, and to provide an electronic device and an electronic appliance. SOLUTION: The method for depositing a pattern 12 of a thin film 52 on a substrate 50 comprises: a first stage where a metal substrate film 60 is deposited on the substrate 50 using a mask 10 by a vapor deposition method, so as to deposit a pattern 12; and a second stage where the substrate 50 is subjected to plating treatment, so as to deposit a metal film 65 on the pattern 12 composed of the metal substrate layer. COPYRIGHT: (C)2006,JPO&NCIPI |
