| 摘要 |
PROBLEM TO BE SOLVED: To perform optical communication by providing an optical element on the face of a semiconductor integrated circuit substrate facing other semiconductor integrated circuit substrate. SOLUTION: The optical elements 46, 48 provided on the face of a first chip 36 facing a second chip 34 are in optical communication with other optical elements by means of through-tubes 46AB, 48AB arranged in through holes 50, 52 formed in the second chip 34. The optical elements 42, 44 provided on the face of the second chip 34 oppositely facing a printed board 32 are in optical communication with other optical elements by means of through-tubes 42AB, 44AB arranged in through holes formed in the printed board 32. COPYRIGHT: (C)2006,JPO&NCIPI |
