| 摘要 |
A method for fabricating a carrier structure integrated with a semiconductor element is proposed. First, a carrier having at least one opening therein is provided, and at least one semiconductor element is embedded in the opening. Then, a photosensitive insulating layer is formed on the carrier and filled into a gap between the opening of the carrier and the semiconductor element, such that the semiconductor element is fixed in the opening. Subsequently, the photosensitive insulating layer is patterned, and build-up circuits are formed on the semiconductor element. By such arrangement, the overall fabrication processes are simplified and the fabrication cost can be reduced.
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