发明名称 |
Semiconductor substrate polishing methods and equipment |
摘要 |
According to one aspect of the present invention, a method of electrochemically polishing a semiconductor substrate may be provided. A semiconductor substrate processing fluid, having a plurality of abrasive particles therein, may be placed between the surface of the semiconductor substrate and the polish head. The polish head may be moved relative to the surface of the semiconductor substrate to cause the abrasive particles to polish the surface of the semiconductor substrate. According to a second aspect of the present invention, a method for electro-polishing a semiconductor substrate may be provided. A semiconductor substrate may be placed in an electrolytic solution. A surface of the semiconductor substrate may be contacted with at least one conductive member. A voltage may be applied across the electrolytic solution and the at least one conductive member. The at least one conductive member may be moved across the surface of the semiconductor substrate.
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申请公布号 |
US2006065633(A1) |
申请公布日期 |
2006.03.30 |
申请号 |
US20040952655 |
申请日期 |
2004.09.28 |
申请人 |
FISCHER PAUL B;BARNS CHRIS E |
发明人 |
FISCHER PAUL B.;BARNS CHRIS E. |
分类号 |
C03C15/00;B44C1/22;C23F1/00;H01L21/306 |
主分类号 |
C03C15/00 |
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