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发明名称
structure of PCB for fabricating semiconductor package
摘要
申请公布号
KR100565765(B1)
申请公布日期
2006.03.29
申请号
KR20000083863
申请日期
2000.12.28
申请人
发明人
分类号
H01L23/12
主分类号
H01L23/12
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代理人
主权项
地址
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