| 摘要 |
<p>A package structure 210 and method of packaging an interferometric modulator with an integrated desiccant. An interferometric modulator 400 is formed on a transparent substrate 250. A backplane 310 is joined to the transparent substrate to form a package structure 210 and to encapsulate the interferometric modulator. A desiccant 500 integrated into the backplane or the transparent substrate is provided to absorb moisture within the package.</p> |
