| 摘要 |
<p>A method of sealing a microelectromechanical system (MEMS) device 76 from ambient conditions is described, wherein the MEMS device 76 is formed on a substrate 72 and a substantially hermetic seal 78 is formed as part of the MEMS device manufacturing process. The method comprises forming a metal seal 78 on the substrate proximate a perimeter of the MEMS device 76 using a method such as photolithography. The metal seal 78 is formed on the substrate while the MEMS device 76 retains a sacrificial layer between conductive members of MEMS elements, and the sacrificial layer is removed after formation of the seal and prior to attachment of a backplane 74.</p> |
