| 发明名称 |
APPARATUS AND METHOD FOR DEPOSITING AND PLANARIZING THIN FILMS OF SEMICONDUCTOR WAFERS |
| 摘要 |
<p>An electroplating apparatus for depositing a metallic layer on a surface of a wafer is provided. In one example, a proximity head capable of being electrically charged as an anode is placed in close proximity to the surface of the wafer. A plating fluid is provided between the wafer and the proximity head to create localized metallic plating.</p> |
| 申请公布号 |
EP1639156(A1) |
申请公布日期 |
2006.03.29 |
| 申请号 |
EP20040753246 |
申请日期 |
2004.05.24 |
| 申请人 |
LAM RESEARCH CORPORATION |
发明人 |
RAVKIN, MIKE;BOYD, JOHN;DORDI, YEZDI, N.;REDEKER, FRED, C.;DE LARIOS, JOHN, M. |
| 分类号 |
C25D5/02;C25D5/22;C25D7/12;H01L21/00;H01L21/288;(IPC1-7):C25D7/12 |
主分类号 |
C25D5/02 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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