A method for forming a joint

摘要

The present invention relates to a method for forming a joint between a module comprising a chip and a substrate comprising a circuitry pattern in such a manner that an electrical connection is formed between the chip and the circuitry pattern by connecting contact areas of the module and contact areas of the circuitry pattern. The module is attached to the substrate substantially entirely. The electrical connection is formed by isotropically conductive adhesive or by pressing mechanically, and the rest of the module is attached to the substrate by settable nonconductive adhesive.