METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE WITH A LEADFRAME AND APPARATUS THEREFOR

摘要

A semiconductor element ( 3 ) is mounted on a flat lead frame ( 11, 11 A) which is provided with two connection conductors ( 4, 5 ) in between which the element ( 3 ) is attached, and the element ( 3 ) is positioned on the first conductor ( 4 ) and the second conductor is brought to a position above that of the element ( 3 ) by a movement outside the plane of the lead frame ( 11, 11 A). The end part of the second conductor ( 5 ) is positioned within the frame ( 11 A) outside the longitudinal position of the first conductor ( 4 ) and is brought to a position above the position of the element ( 3 ) by means of bending along a bending axis. The bending axis makes an oblique angle with the longitudinal axis of the end part. In this manner, a semiconductor device is obtained comprising as a semiconductor element at least one diode or transistor.