Edge-sealed substrates and methods for effecting the same

摘要

Methods and systems of protecting substrates (200) that are intended for use in fluidic devices are described. In accordance with one embodiment, sealant material is applied over one or more edges (202) of at least one multichip module substrate (142) that is intended for use in a fluidic device. At least one edge (202) has an exposed electrical interconnect (108) and the sealant material is applied over less than an entirety of the substrate (142) and sufficiently to cover the exposed electrical interconnect. The sealant material is exposed to conditions effective to seal the one or more edges.