发明名称 |
System and method for protecting microelectromechanical systems array using structurally reinforced back-plate |
摘要 |
Disclosed is an electronic device utilizing interferometric modulation and a package of the device. The packaged device includes a substrate 101, an interferometric modulation display array 111 formed on the substrate 101, and a back-plate 130. The back-plate is placed over the display array 111 with a gap 124 between the back-plate and the display array. The device further includes reinforcing structures which are integrated with the back-plate. The reinforcing structures add stiffness to the back-plate. The back-plate may have a thickness varying along an edge thereof. |
申请公布号 |
EP1640329(A2) |
申请公布日期 |
2006.03.29 |
申请号 |
EP20050255678 |
申请日期 |
2005.09.14 |
申请人 |
IDC, LLC |
发明人 |
CUMMINGS, WILLIAM J.;GALLY, BRIAN J.;PALMATEER, LAUREN |
分类号 |
B81B7/00 |
主分类号 |
B81B7/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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