| 摘要 |
Upper, inner and lower sections ( 182, 180 and 184 ) of a PCB ( 100 ) are formed with each section having a substrate ( 140, 150 and 160 ) having patterned layers of metallization ( 105 and 110, 115 and 120 , and 125 and 130 ), respectively. Some of the patterned layers of metallization ( 110, 115, 120 , and 125 ) have thicker portions ( 171, 173 ) and part ( 188 ) of portion ( 186 ), and thinner portions ( 172, 174, 187, 190, 191, 192 and 193 ). The resultant thinner portion ( 175 and 194 ) in the prepreg layers ( 145 and 155 ) with the respective thicker portions of metallization provide decoupling capacitors, while the resultant thicker portions ( 196 and 198 ), for example, provide a lower capacitance for improved trace impedance for the signal traces ( 191 and 192 ).
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