发明名称 |
Circuit board producing method and circuit board producing device |
摘要 |
A method of manufacturing multi-layer circuit board comprising: a hole forming step for forming through-holes or blind-holes in a plate-form or sheet-form board material, and a filling step for filling a paste into through-holes or blind-holes formed in the hole forming step by using a filling means. A second paste is supplied to the paste in the filling process by using a paste supplying means to stabilized a viscosity of the paste and the paste is reliably filled into the through-holes or the blind-holes.
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申请公布号 |
US7018672(B2) |
申请公布日期 |
2006.03.28 |
申请号 |
US20020182632 |
申请日期 |
2002.11.21 |
申请人 |
MATUSHITA ELECTRIC INDUSTRIAL CO., LTD. |
发明人 |
TAKENAKA TOSHIAKI;NISHII TOSHIHIRO;SUGITA YUICHIRO;NAKAMURA SHINJI;KOMODA HIDEAKI;KONDO TOSHIKAZU |
分类号 |
B05D5/12;B05D7/00;B05C11/04;B05D3/12;B05D7/24;B41F9/10;B41M1/12;H05K1/09;H05K3/12;H05K3/24;H05K3/40;H05K3/46 |
主分类号 |
B05D5/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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