发明名称 Conductive thin film pattern and method of forming the same, method of manufacturing thin film magnetic head, method of manufacturing thin film inductor, and method of manufacturing micro device
摘要 A high-precision conductive thin film pattern having a high aspect ratio and a method of forming the same are provided. Further, a method of manufacturing a thin film magnetic head, a thin film inductor, and a micro device each including such a conductive thin film pattern is provided. Since a stacked layer structure including two conductive layer patterns formed by plating growth using an underfilm pattern as an electrode film and an intermediate conductive layer pattern sandwiched by the two conductive layer patterns is provided, a thicker conductive thin film pattern is obtained. An intermediate conductive layer covering a first resist frame is formed and, after that, a second resist frame is formed in a position corresponding to the first resist frame. Consequently, without causing inter-mixing, the first and second resist frames can be stacked. Thus, a thicker conductive thin film pattern can be formed easily with high precision.
申请公布号 US7018548(B2) 申请公布日期 2006.03.28
申请号 US20030617131 申请日期 2003.07.11
申请人 TDK CORPORATION 发明人 KAMIJIMA AKIFUMI
分类号 C25D5/02;H01L21/027;C25D7/00;G03F7/00;G11B5/31;H01F17/00;H01F41/04;H01F41/34 主分类号 C25D5/02
代理机构 代理人
主权项
地址