发明名称 Layer sequence built on a substrate in thin-film technology
摘要 The layer sequence built on a substrate in thin-film technology includes an electrically conductive sputtered layer and an electrically conductive reinforcing layer for reinforcing or strengthening the sputtered layer, which is applied on the sputtered layer by a method other than sputtering. In order to remove conducting material from the conductive layers with the aid of a laser for the purposes of adjustment while producing as little contaminating material as possible, the electrically conductive reinforcing layer has a reduced thickness or is completely eliminated in regions of the electrically conductive layers to be adjusted than in other regions outside of the regions to be adjusted.
申请公布号 US7018720(B1) 申请公布日期 2006.03.28
申请号 US20000532144 申请日期 2000.03.21
申请人 ROBERT BOSCH GMBH 发明人 SCHALLNER MARTIN;STEINERT SOEREN
分类号 B32B3/10;H01C17/12;H01C17/242 主分类号 B32B3/10
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