发明名称 |
Layer sequence built on a substrate in thin-film technology |
摘要 |
The layer sequence built on a substrate in thin-film technology includes an electrically conductive sputtered layer and an electrically conductive reinforcing layer for reinforcing or strengthening the sputtered layer, which is applied on the sputtered layer by a method other than sputtering. In order to remove conducting material from the conductive layers with the aid of a laser for the purposes of adjustment while producing as little contaminating material as possible, the electrically conductive reinforcing layer has a reduced thickness or is completely eliminated in regions of the electrically conductive layers to be adjusted than in other regions outside of the regions to be adjusted.
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申请公布号 |
US7018720(B1) |
申请公布日期 |
2006.03.28 |
申请号 |
US20000532144 |
申请日期 |
2000.03.21 |
申请人 |
ROBERT BOSCH GMBH |
发明人 |
SCHALLNER MARTIN;STEINERT SOEREN |
分类号 |
B32B3/10;H01C17/12;H01C17/242 |
主分类号 |
B32B3/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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