发明名称 Wire bond with improved shear strength
摘要 <p>A wire bonding method and a wire bond formed from the method are provided to improve shear strength of a wire that is connected to a bonding surface. The wire bond includes a bonded wire having a base in contact with the bonding surface, a recessed portion formed substantially at an edge of the bonded wire wherein at least a portion of an underside of the recessed portion is in contact with the bonding surface, and a length of wire extending from the recessed portion.</p>
申请公布号 SG120261(A1) 申请公布日期 2006.03.28
申请号 SG20050005089 申请日期 2005.08.10
申请人 ASM TECHNOLOGY SINGAPORE PTE LTD 发明人 WONG YAM MO
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