| 摘要 |
A carrying device carries a semiconductor wafer above a base disposed in a transfer chamber or the like. The carrying device comprises pick for holding the object, a main arm mechanism adapted to bend and stretch in a horizontal operating plane, and an auxiliary arm mechanism adapted to bend and stretch in a vertical operating plane. The main arm mechanism includes a proximal end supported by the base, and distal end connected to the pick, respectively. The auxiliary arm mechanism includes a main arm and an arm linkage. The main arm has a proximal end supported by the base, and distal end. The arm linkage has a proximal end connected to the distal end of the main arm and a distal end connected to the pick.
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