Method for forming metal wiring layer of semiconductor device,申请号KR20040002666-传众专利搜索

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发明名称	Method for forming metal wiring layer of semiconductor device
摘要
申请公布号	KR100564605(B1)	申请公布日期	2006.03.28
申请号	KR20040002666	申请日期	2004.01.14
申请人		发明人
分类号	H01L21/28;H01L21/285;H01L21/768;H01L29/15	主分类号	H01L21/28
代理机构		代理人
主权项
地址

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