发明名称 Thin film forming apparatus and thin film forming method
摘要 Prior to the start of transfer of an insulation film to a substrate, the degree of opening of a butterfly valve is set small so that evaporation of a solvent component contained in the insulation film is suppressed and the fluidity of the insulation film is ensured at the start of the transfer. On the other hand, the butterfly valve is totally opened at the start of the transfer, so that the pressure inside a thin film forming chamber rapidly decreases and transfer of the insulation film to the substrate is performed always in a low-pressure state (high-degree of vacuum).
申请公布号 US7017637(B2) 申请公布日期 2006.03.28
申请号 US20020251475 申请日期 2002.09.18
申请人 NIPPON TELEGRAPH AND TELEPHONE CORPORATION 发明人 UEYAMA TSUTOMU;ISEKI IZURU;SATO NORIO;MACHIDA KATSUYUKI;KYURAGI HAKARU
分类号 H01L21/31;B05D1/28;B32B37/10;B32B38/00;H01L21/00;H01L21/30;H01L21/687 主分类号 H01L21/31
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