| 摘要 |
A compact imaging module comprising a case having a lens holding barrel portion, an optical system member housed in the lens holding barrel portion, a circuit substrate having a wiring pattern and disposed in an image side of the optical system member, a plurality of electrodes disposed on the circuit substrate, an imaging sensor mounted on a surface of the circuit substrate, an opposite side of the contained optical system member, and a frame member provided on a periphery of the circuit substrate, the case including a substrate mounting surface having a sensor window, the circuit substrate being attached to the substrate mounting surface of the case, the frame member including conductive electrodes to guide out a signal of the imaging sensor mounted on the circuit substrate.
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