Polishing pad using for polishing wafer surface,申请号KR19990043788-传众专利搜索

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发明名称	Polishing pad using for polishing wafer surface
摘要
申请公布号	KR100564558(B1)	申请公布日期	2006.03.28
申请号	KR19990043788	申请日期	1999.10.11
申请人		发明人
分类号	B24D11/00	主分类号	B24D11/00
代理机构		代理人
主权项
地址

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