发明名称 Method of providing multiple logical bits per memory cell
摘要 A semiconductor substrate is provided over which electrically conductive columns are formed along with electrically conductive rows crossing over the electrically conductive columns. A plurality of memory components are formed each having a resistance value corresponding to multiple logical bits and non-volatile memory cells are each formed by connecting a memory component between an electrically conductive row and an electrically conductive column.
申请公布号 US7019381(B2) 申请公布日期 2006.03.28
申请号 US20030611544 申请日期 2003.07.01
申请人 HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. 发明人 SMITH KENNETH K.;BRANDENBERGER SARAH M.;BLOOMQUIST, LEGAL REPRESENTATIVE JUDY;ELDREDGE KENNETH J.;VAN BROCKLIN ANDREW L.;FRICKE PETER J.
分类号 H01L29/00;G11C11/56 主分类号 H01L29/00
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