Terminal, semiconductor device, terminal forming method and flip chip semiconductor device manufacturing method

摘要

In a terminal, a semiconductor device, a terminal forming method and a flip chip semiconductor device manufacturing method, it is possible to lessen damage to a semiconductor element due to vibration caused by an ultrasonic wave and settle misalignment and height unevenness of terminals. The terminal includes a pad provided on an active surface of an electric element having an IC chip, a metal post connected to the pad, and a projection electrode provided on the metal post.