发明名称 Wafer processing apparatus and method of use
摘要 A system, apparatus, and method for thermal processing of substrates undergoing lithographic chemical processes is provided. The thermal processing system includes at least one heating element, a heat distributing plate, having a heating surface and being disposed in thermal communication with the at least one heating element. The heat distributing plate is constructed and arranged to distribute heat from the heating element onto the heating surface. A substrate support, supports a substrate at a position above the heating surface and the system includes an actuator that rotates the substrate relative to the heating surface during a heat transfer operation.
申请公布号 US7019268(B2) 申请公布日期 2006.03.28
申请号 US20040783088 申请日期 2004.02.23
申请人 ASML NETHERLANDS B.V. 发明人 PAXTON THEODORE A.;HIAR TODD
分类号 H05B3/68;G03F7/20;H01L21/00 主分类号 H05B3/68
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