Device and method for electrochemical plating of Cu,申请号KR20030101204-传众专利搜索

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发明名称	Device and method for electrochemical plating of Cu
摘要
申请公布号	KR100564799(B1)	申请公布日期	2006.03.27
申请号	KR20030101204	申请日期	2003.12.31
申请人		发明人
分类号	H01L21/288	主分类号	H01L21/288
代理机构		代理人
主权项
地址

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