发明名称 DEVICE AND METHOD FOR SURFACE TREATMENT SUCH AS PLASMA TREATMENT
摘要 [PROBLEM] To effectively perform surface treatment of a large-area object even when a surface treatment device has short holes such as slits through which a treatment gas is blown against a surface of the object. [MEANS FOR SOLVING THE PROBLEM] A processing section (1) of a plasma surface treatment device (M) has a plurality of electrode plates (11, 12) arranged side by side. Between adjacent electrode plates, a slit-shaped hole (10a) is formed. A plurality of holes (10a) arranged side by side constitute a hole group (100). A work (W) to be treated is moved in the direction of the extension of the slits (10a) by a moving mechanism (4).
申请公布号 KR20060027357(A) 申请公布日期 2006.03.27
申请号 KR20057024662 申请日期 2005.12.23
申请人 SEKISUI CHEMICAL CO., LTD. 发明人 ANZAI JUNICHIRO;NAKANO YOSHINORI;KAWASAKI SHINICHI;NAKATAKE SUMIO;MAYUMI SATOSHI;MIYAMOTO EIJI;TAKEUCHI TOSHIMASA
分类号 H01L21/205;H01L21/00;H01L21/31 主分类号 H01L21/205
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