| 摘要 |
Described herein are systems, devices, and methods relating to packaging electronic devices, for example, microelectromechanical systems (MEMS) devices, includi ng optical modulators such as interferometric optical modulators. The packaging system disclosed herein comprises a patterned spacer 825 that, in some embodiments, is fabricated using thin-film methods. In some embodiments, the spacer 825, together with a substrate 816 and backplate 828, are put together to create a package 800 for an electronic device.</SDO AB>
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