CAPACITOR LAYER FORMING MATERIAL AND PRINTED-WIRING BOARD HAVING ENBEDDED CAPACITOR CIRCUIT OBTAINED BY USING IT

摘要

PROBLEM TO BE SOLVED: To provide a capacitor layer forming material having a conductive layer excellent in an adhesion with a dielectric layer for forming the lower electrode of the capacitor circuit.

SOLUTION: The capacitor layer forming material of the printed-wiring board having the dielectric layer between a first conductive layer used for forming an upper electrode and a second conductive layer used for forming the lower electrode uses the capacitor layer forming material, using the second conductive layer having a layer structure shown in the followings (1) or (2). The second conductive layer is the conductive layer having a pure nickel layer and a nickel-phosphorous alloy layer sequentially laminated on the surface of a copper layer (1). The second conductive layer is the conductive layer having a nickel-phosphorous alloy layer/a pure nickel layer/a nickel-phosphorous alloy layer sequentially laminated on the surface of the copper layer (2).

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