| 摘要 |
PROBLEM TO BE SOLVED: To provide an optical inspection system based on a camera having performance to rapidly inspect a microelectronics or a semiconductor component. SOLUTION: A camera module for use in the optical inspection system includes a beamsplitter assembly, a first detector assembly, and a second detector assembly. The beamsplitter assembly defines orthogonally arranged first and second sides that are optically separated by a beamsplitter face. The first detector assembly includes a detector array for sensing an image. The first detector assembly is optically associated with the first side of the beamsplitter assembly. The second detector assembly similarly includes a detector array for sensing an image. The second detector assembly is optically associated with the second side of the beamsplitter. Further, the first and second detector assemblies are substantially optically aligned relative to the beamsplitter assembly. COPYRIGHT: (C)2006,JPO&NCIPI
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