| 摘要 |
PROBLEM TO BE SOLVED: To provide a positioning method between a soldering pin group of a belt-like flexible board and an electrode pattern at a wiring board side by utilizing chip components originally mounted on the wiring board. SOLUTION: The positioning method is applied to the belt-like flexible board in the case of applying soldering connection of each pin 61 of the soldering pin group 6 of the belt-like flexible board 5 such as an FFC respectively to each land 21 of a multi-pole pattern 2 formed to the wiring board 1 mounted with the chip component 9 such as a resistive element. The flat outside 91 of the chip component 9 is located at the estimated position of a width directional end edge 51 of the belt-like flexible board 5, derived from a soldered position of the both estimated when each pin 61 is individually solder-connected to each land 21. The width directional end edge 51 of the beltlike flexible board 5 is located along the outside 91 of the chip component 9 to position the pins 61 to the lands 21 individually in an overlapping state. COPYRIGHT: (C)2006,JPO&NCIPI
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