| 摘要 |
An apparatus for treating a substrate includes a stage adapted to receive the substrate; a gas shield facing the substrate and having a retention space, the gas shield including: a top plate; a bottom plate facing the substrate and having pump holes around the retention space; and a middle plate between the top and bottom plates and having a first gas path communicating with the retention space and a second gas path communicating with the pump holes; an energy source facing the top plate such that light emitted therefrom irradiates a part of the substrate through the retention space; a reaction gas supplier connected to the first gas path; and a pressure adjusting device connected to the second gas path.
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