发明名称 |
Solder foil semiconductor device and electronic device |
摘要 |
A solder foil formed from a material comprising particles of Cu, etc. as metal particles and Sn particles as solder particles by rolling is suitable for solder bonding at a high temperature side in temperature-hierarchical bonding, and semiconductor devices and electronic devices produced by use of such solder bonding have distinguished reliability of mechanical characteristics, etc. |
申请公布号 |
US2006061974(A1) |
申请公布日期 |
2006.03.23 |
申请号 |
US20040451610 |
申请日期 |
2004.03.31 |
申请人 |
|
发明人 |
SOGA TASAO;HATA HANAE;ISHIDA TOSHIHARU;ISHIDA KANKO;NAKATSUKA TETSUYA;OKAMOTO MASAHIDE;MIURA KAZUMA |
分类号 |
H05K1/16;B23K3/06;B23K35/14;H01L23/48;H05K1/14;H05K3/34 |
主分类号 |
H05K1/16 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|