MULTILAYER BOARD INCORPORATING CHIP ELECTRONIC COMPONENT AND METHOD FOR PRODUCING THE SAME

摘要

In the case of a conventional multilayer ceramic board, the electronic components incorporated and wiring conductors formed previously on and in the multilayer board are connected only on one side of the upper or lower part of the electronic component at the production stage, and thereby connection reliability deteriorates because of misregistration at the time of overlaying or difference in contraction behavior at the time of baking. A multilayer board (10) incorporating chip electronic components comprises a multilayer board (11) formed by overlaying a plurality of dielectric layers (11A) and having an internal conductor pattern (12), and a chip electronic component (13) provided at the interface between the upper and lower dielectric layers (11A) and having an external terminal electrode (13A). The external terminal electrode (13A) is connected with an in-plane conductor (12A) provided at the interface through a first connection conductor (14A) extending downward from the interface between the upper and lower dielectric layers (11A) along the chip electronic component (13) and a second connection conductor (14B) extending upward from the interface between the upper and lower dielectric layers (11A) along the chip electronic component (13).