发明名称 Metal-ceramic substrate for electronics switches or modules comprises a ceramic layer containing aluminum oxide, zirconium oxide and yttrium oxide with a copper foil or layer formed on both sides
摘要 Metal-ceramic substrate (1) comprises a ceramic layer (2) containing 91-98 weight % Al2O3, 2-9 weight % ZrO2 and 0.04-1 weight % Y2O3 with a copper foil (3, 4) or layer formed on both sides. The adhesive strength of the metal foil is more than 40 N/cm.
申请公布号 DE102004012231(B4) 申请公布日期 2006.03.23
申请号 DE20041012231 申请日期 2004.03.12
申请人 CURAMIK ELECTRONICS GMBH 发明人 SCHULZ-HARDER, JUERGEN;EXEL, KARL
分类号 C04B41/88;B32B15/04;C04B35/119;C04B37/02;C04B41/51;H01L23/14;H01L23/373;H01L23/498;H05K1/03 主分类号 C04B41/88
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